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Vulnerability record · CVE-2017-18329 · published 3 January 2019

CVE-2017-18329: Qualcomm mdm9615 firmware memory buffer overflow vulnerability

Qualcomm · Mdm9615 Firmware

Possible Buffer overflow when transmitting an RTP packet in snapdragon automobile and snapdragon wear in versions MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 810, SD 820, SD 835, SD 845 / SD 850, SDA660, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130

7.8 CVSS 3.0 High EPSS 0.24% · top 86.1% CWE-119 · Memory buffer overflow
7.8CVSS 3.0 base score, v2 7.2
0.24%EPSS exploitation probability, 30 days
NoNot in CISA KEV
37Affected product versions listed by NVD
4References
17 Jun 2026Last modified by NVD

Description

Possible Buffer overflow when transmitting an RTP packet in snapdragon automobile and snapdragon wear in versions MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 810, SD 820, SD 835, SD 845 / SD 850, SDA660, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130

CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Affected products

37 vulnerable configurations from NVD's CPE data, grouped by vendor and product.

References

LinkTags
http://www.securityfocus.com/bid/106128 Third Party AdvisoryVDB Entry
https://www.qualcomm.com/company/product-security/bulletins Vendor Advisory
http://www.securityfocus.com/bid/106128 Third Party AdvisoryVDB Entry
https://www.qualcomm.com/company/product-security/bulletins Vendor Advisory

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Related vulnerabilities

Same products first, then exploited flaws of the same weakness class.

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Source: NIST National Vulnerability Database (record CVE-2017-18329), CISA KEV, FIRST EPSS (scores of 2026-10-05). This page is refreshed as NVD updates the record.