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Vulnerability record · CVE-2022-25720 · published 19 October 2022

CVE-2022-25720: Qualcomm apq8009 firmware vulnerability

Qualcomm · Apq8009 Firmware

Memory corruption in WLAN due to out of bound array access during connect/roaming in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables

9.8 CVSS 3.1 Critical EPSS 0.46% · top 62.8% CWE-129 · CWE-129
9.8CVSS 3.1 base score
0.46%EPSS exploitation probability, 30 days
NoNot in CISA KEV
150Affected product versions listed by NVD
2References
17 Jun 2026Last modified by NVD

Description

Memory corruption in WLAN due to out of bound array access during connect/roaming in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables

CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H

Affected products

150 vulnerable configurations from NVD's CPE data, grouped by vendor and product.

References

LinkTags
https://www.qualcomm.com/company/product-security/bulletins/october-2022-bulletin PatchVendor Advisory
https://www.qualcomm.com/company/product-security/bulletins/october-2022-bulletin PatchVendor Advisory

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Related vulnerabilities

Same products first, then exploited flaws of the same weakness class.

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Source: NIST National Vulnerability Database (record CVE-2022-25720), CISA KEV, FIRST EPSS (scores of 2026-09-29). This page is refreshed as NVD updates the record.