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Vulnerability record · CVE-2023-21672 · published 4 July 2023

CVE-2023-21672: Qualcomm fastconnect 6700 firmware use after free vulnerability

Qualcomm · Fastconnect 6700 Firmware

Memory corruption in Audio while running concurrent tunnel playback or during concurrent audio tunnel recording sessions.

7.8 CVSS 3.1 High EPSS 0.12% · top 98.5% CWE-416 · Use after free
7.8CVSS 3.1 base score
0.12%EPSS exploitation probability, 30 days
NoNot in CISA KEV
57Affected product versions listed by NVD
2References
17 Jun 2026Last modified by NVD

Description

Memory corruption in Audio while running concurrent tunnel playback or during concurrent audio tunnel recording sessions.

CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Affected products

57 vulnerable configurations from NVD's CPE data, grouped by vendor and product.

References

LinkTags
https://www.qualcomm.com/company/product-security/bulletins/july-2023-bulletin PatchVendor Advisory
https://www.qualcomm.com/company/product-security/bulletins/july-2023-bulletin PatchVendor Advisory

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Same products first, then exploited flaws of the same weakness class.

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Source: NIST National Vulnerability Database (record CVE-2023-21672), CISA KEV, FIRST EPSS (scores of 2026-10-15). This page is refreshed as NVD updates the record.