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Vulnerability record · CVE-2021-30341 · published 14 June 2022

CVE-2021-30341: Qualcomm apq8009w firmware out-of-bounds write vulnerability

Qualcomm · Apq8009w Firmware

Improper buffer size validation of DSM packet received can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables

9.8 CVSS 3.1 Critical EPSS 0.80% · top 44.8% CWE-787 · Out-of-bounds write
9.8CVSS 3.1 base score, v2 10.0
0.80%EPSS exploitation probability, 30 days
NoNot in CISA KEV
120Affected product versions listed by NVD
2References
17 Jun 2026Last modified by NVD

Description

Improper buffer size validation of DSM packet received can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables

CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H

Affected products

120 vulnerable configurations from NVD's CPE data, grouped by vendor and product.

References

LinkTags
https://www.qualcomm.com/company/product-security/bulletins/april-2022-bulletin Vendor Advisory
https://www.qualcomm.com/company/product-security/bulletins/april-2022-bulletin Vendor Advisory

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Same products first, then exploited flaws of the same weakness class.

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Source: NIST National Vulnerability Database (record CVE-2021-30341), CISA KEV, FIRST EPSS (scores of 2026-10-11). This page is refreshed as NVD updates the record.