← Vulnerability feed

Vulnerability record · CVE-2020-11239 · published 9 June 2021

CVE-2020-11239: Qualcomm apq8009 firmware use after free vulnerability

Qualcomm · Apq8009 Firmware

Use after free issue when importing a DMA buffer by using the CPU address of the buffer due to attachment is not cleaned up properly in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables

7.8 CVSS 3.1 High EPSS 0.22% · top 88.7% CWE-416 · Use after free
7.8CVSS 3.1 base score, v2 7.2
0.22%EPSS exploitation probability, 30 days
NoNot in CISA KEV
150Affected product versions listed by NVD
2References
17 Jun 2026Last modified by NVD

Description

Use after free issue when importing a DMA buffer by using the CPU address of the buffer due to attachment is not cleaned up properly in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables

CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Affected products

150 vulnerable configurations from NVD's CPE data, grouped by vendor and product.

References

LinkTags
https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin PatchVendor Advisory
https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin PatchVendor Advisory

Track CVE-2020-11239 inside VULONE

Watch it alongside the ransomware crews, C2 infrastructure and forum chatter that reference it, query it through the API and pull it into your SIEM over TAXII.

Start free Open in platform

Related vulnerabilities

Same products first, then exploited flaws of the same weakness class.

7.8CVE-2023-33107Qualcomm Graphics Linux integer overflow memory corruptionCVE-2023-33107 is an integer overflow (CWE-190) in Qualcomm Graphics Linux that causes memory corruption when a shared virtual memory region is assig…KEVEPSS 0.89%analysed7.8CVE-2023-33063Qualcomm DSP Services use-after-free memory corruptionCVE-2023-33063 is a use-after-free memory corruption flaw in Qualcomm DSP Services, triggered during a remote call from the high-level operating syst…KEVEPSS 0.69%analysed7.8CVE-2022-22071Qualcomm chipset shell memory use-after-free via IOCTL munmapA use-after-free exists in Qualcomm Snapdragon and related chipset firmware when process shell memory is freed through an IOCTL munmap call while pro…KEVEPSS 0.46%analysed7.8CVE-2020-11261Qualcomm Snapdragon chipsets memory corruption via improper allocation size checkQualcomm Snapdragon firmware fails to return an error when a user application requests a very large memory allocation, leading to memory corruption (…KEVEPSS 1.6%analysed7.8CVE-2021-1905Qualcomm Snapdragon chipsets use-after-free in memory mapping handlingA use-after-free flaw exists in multiple Qualcomm Snapdragon chipset families due to improper handling of memory mapping when multiple processes oper…KEVEPSS 1.5%analysed5.5CVE-2021-1906Qualcomm Snapdragon GPU address deregistration failure causes allocation denialImproper handling of address deregistration on failure in Qualcomm Snapdragon chipsets can cause subsequent GPU address allocation to fail. The flaw …KEVEPSS 0.52%analysed9.8CVE-2025-21483Qualcomm apq8017 firmware memory buffer overflow vulnerabilityMemory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs.EPSS 0.40%9.8CVE-2023-22388Qualcomm 315 5g iot modem firmware out-of-bounds write vulnerabilityMemory Corruption in Multi-mode Call Processor while processing bit mask API.EPSS 0.35%

Source: NIST National Vulnerability Database (record CVE-2020-11239), CISA KEV, FIRST EPSS (scores of 2026-09-26). This page is refreshed as NVD updates the record.