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Vulnerability record · CVE-2019-2275 · published 6 November 2019

CVE-2019-2275: Qualcomm mdm9150 firmware memory buffer overflow vulnerability

Qualcomm · Mdm9150 Firmware

While deserializing any key blob during key operations, buffer overflow could occur exposing partial key information if any key operations are invoked(Depends on CVE-2018-13907) in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in MDM9150, MDM9205, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS404, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130

5.5 CVSS 3.1 Medium EPSS 0.19% · top 92.6% CWE-119 · Memory buffer overflow
5.5CVSS 3.1 base score, v2 2.1
0.19%EPSS exploitation probability, 30 days
NoNot in CISA KEV
43Affected product versions listed by NVD
2References
17 Jun 2026Last modified by NVD

Description

While deserializing any key blob during key operations, buffer overflow could occur exposing partial key information if any key operations are invoked(Depends on CVE-2018-13907) in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in MDM9150, MDM9205, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS404, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130

CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:N/A:N

Affected products

43 vulnerable configurations from NVD's CPE data, grouped by vendor and product.

References

LinkTags
https://www.qualcomm.com/company/product-security/bulletins Vendor Advisory
https://www.qualcomm.com/company/product-security/bulletins Vendor Advisory

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Same products first, then exploited flaws of the same weakness class.

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Source: NIST National Vulnerability Database (record CVE-2019-2275), CISA KEV, FIRST EPSS (scores of 2026-10-03). This page is refreshed as NVD updates the record.