Vulnerability record · CVE-2019-14093 · published 30 July 2020
CVE-2019-14093: Qualcomm apq8009 firmware vulnerability
Qualcomm · Apq8009 Firmware
Array out of bound access can occur in display module due to lack of bound check on input parcel received in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9650, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, QCM2150, QCS405, QCS605, QM215, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM632, SDM636, SDM660, SDX20
Description
Array out of bound access can occur in display module due to lack of bound check on input parcel received in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9650, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, QCM2150, QCS405, QCS605, QM215, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM632, SDM636, SDM660, SDX20
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Affected products
31 vulnerable configurations from NVD's CPE data, grouped by vendor and product.
References
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Related vulnerabilities
Same products first, then exploited flaws of the same weakness class.
Source: NIST National Vulnerability Database (record CVE-2019-14093), CISA KEV, FIRST EPSS (scores of 2026-10-04). This page is refreshed as NVD updates the record.