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Vulnerability record · CVE-2018-11982 · published 20 September 2018

CVE-2018-11982: Qualcomm mdm9206 firmware double free vulnerability

Qualcomm · Mdm9206 Firmware

In Snapdragon (Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016, a double free of ASN1 heap memory used for EUTRA CAP container occurs during UTRAN to LTE Capability inquiry procedure.

8.8 CVSS 3.0 High EPSS 0.39% · top 69.2% CWE-415 · Double free
8.8CVSS 3.0 base score, v2 8.3
0.39%EPSS exploitation probability, 30 days
NoNot in CISA KEV
28Affected product versions listed by NVD
2References
17 Jun 2026Last modified by NVD

Description

In Snapdragon (Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016, a double free of ASN1 heap memory used for EUTRA CAP container occurs during UTRAN to LTE Capability inquiry procedure.

CVSS:3.0/AV:A/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H

Affected products

28 vulnerable configurations from NVD's CPE data, grouped by vendor and product.

References

LinkTags
https://www.qualcomm.com/company/product-security/bulletins Third Party Advisory
https://www.qualcomm.com/company/product-security/bulletins Third Party Advisory

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Related vulnerabilities

Same products first, then exploited flaws of the same weakness class.

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Source: NIST National Vulnerability Database (record CVE-2018-11982), CISA KEV, FIRST EPSS (scores of 2026-10-07). This page is refreshed as NVD updates the record.