Vulnerability record · CVE-2017-18330 · published 3 January 2019
CVE-2017-18330: Qualcomm ipq8074 firmware vulnerability
Qualcomm · Ipq8074 Firmware
Buffer overflow in AES-CCM and AES-GCM encryption via initialization vector in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016.
Description
Buffer overflow in AES-CCM and AES-GCM encryption via initialization vector in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016.
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Affected products
39 vulnerable configurations from NVD's CPE data, grouped by vendor and product.
References
| Link | Tags |
|---|---|
| http://www.securityfocus.com/bid/106128 | Third Party AdvisoryVDB Entry |
| https://www.qualcomm.com/company/product-security/bulletins | Vendor Advisory |
| http://www.securityfocus.com/bid/106128 | Third Party AdvisoryVDB Entry |
| https://www.qualcomm.com/company/product-security/bulletins | Vendor Advisory |
Track CVE-2017-18330 inside VULONE
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Related vulnerabilities
Same products first, then exploited flaws of the same weakness class.
Source: NIST National Vulnerability Database (record CVE-2017-18330), CISA KEV, FIRST EPSS (scores of 2026-10-05). This page is refreshed as NVD updates the record.