← Vulnerability feed

Vulnerability record · CVE-2017-18314 · published 20 September 2018

CVE-2017-18314: Qualcomm mdm9206 firmware vulnerability

Qualcomm · Mdm9206 Firmware

In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ.

9.8 CVSS 3.0 Critical EPSS 0.94% · top 40.3%
9.8CVSS 3.0 base score, v2 10.0
0.94%EPSS exploitation probability, 30 days
NoNot in CISA KEV
37Affected product versions listed by NVD
4References
17 Jun 2026Last modified by NVD

Description

In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ.

CVSS:3.0/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H

Affected products

37 vulnerable configurations from NVD's CPE data, grouped by vendor and product.

References

LinkTags
https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components Vendor Advisory
https://www.qualcomm.com/company/product-security/bulletins Vendor Advisory
https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components Vendor Advisory
https://www.qualcomm.com/company/product-security/bulletins Vendor Advisory

Track CVE-2017-18314 inside VULONE

Watch it alongside the ransomware crews, C2 infrastructure and forum chatter that reference it, query it through the API and pull it into your SIEM over TAXII.

Start free Open in platform

Related vulnerabilities

Same products first, then exploited flaws of the same weakness class.

7.8CVE-2021-1905Qualcomm Snapdragon chipsets use-after-free in memory mapping handlingA use-after-free flaw exists in multiple Qualcomm Snapdragon chipset families due to improper handling of memory mapping when multiple processes oper…KEVEPSS 1.5%analysed5.5CVE-2021-1906Qualcomm Snapdragon GPU address deregistration failure causes allocation denialImproper handling of address deregistration on failure in Qualcomm Snapdragon chipsets can cause subsequent GPU address allocation to fail. The flaw …KEVEPSS 0.52%analysed9.8CVE-2023-22388Qualcomm 315 5g iot modem firmware out-of-bounds write vulnerabilityMemory Corruption in Multi-mode Call Processor while processing bit mask API.EPSS 0.35%9.8CVE-2023-22385Qualcomm 315 5g iot modem firmware out-of-bounds write vulnerabilityMemory Corruption in Data Modem while making a MO call or MT VOLTE call.EPSS 0.42%9.8CVE-2022-40510Qualcomm apq8009 firmware out-of-bounds write vulnerabilityMemory corruption due to buffer copy without checking size of input in Audio while voice call with EVS vocoder.EPSS 0.43%9.8CVE-2022-33259Qualcomm mdm8207 firmware classic buffer overflow vulnerabilityMemory corruption due to buffer copy without checking the size of input in modem while decoding raw SMS received.EPSS 0.42%9.8CVE-2022-33211Qualcomm mdm8207 firmware improper input validation vulnerabilitymemory corruption in modem due to improper check while calculating size of serialized CoAP messageEPSS 0.42%9.8CVE-2022-25740Qualcomm mdm8207 firmware classic buffer overflow vulnerabilityMemory corruption in modem due to buffer overwrite while building an IPv6 multicast address based on the MAC address of the ifaceEPSS 0.42%

Source: NIST National Vulnerability Database (record CVE-2017-18314), CISA KEV, FIRST EPSS (scores of 2026-10-06). This page is refreshed as NVD updates the record.