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Vulnerability record · CVE-2017-18173 · published 6 May 2019

CVE-2017-18173: Qualcomm sd 425 firmware integer overflow vulnerability

Qualcomm · Sd 425 Firmware

In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.

7.8 CVSS 3.0 High EPSS 0.23% · top 87.7% CWE-190 · Integer overflow
7.8CVSS 3.0 base score, v2 7.2
0.23%EPSS exploitation probability, 30 days
NoNot in CISA KEV
13Affected product versions listed by NVD
2References
17 Jun 2026Last modified by NVD

Description

In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.

CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Affected products

13 vulnerable configurations from NVD's CPE data, grouped by vendor and product.

References

LinkTags
https://www.qualcomm.com/company/product-security/bulletins Vendor Advisory
https://www.qualcomm.com/company/product-security/bulletins Vendor Advisory

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Related vulnerabilities

Same products first, then exploited flaws of the same weakness class.

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Source: NIST National Vulnerability Database (record CVE-2017-18173), CISA KEV, FIRST EPSS (scores of 2026-10-07). This page is refreshed as NVD updates the record.